Mark LaPedus EE Times (04/21/2010 11:33 AM EST)

SAN JOSE, Calif. -- Bosch, Freescale Semiconductor, Infineon Technologies, NXP Semiconductors and STMicroelectronics have formed a consortium to explore and standardize the acceptance of alternatives for high-lead solder for attaching die to semiconductor packages during IC manufacturing.

The five company consortium is known as the DA5 (Die Attach 5). Today, semiconductor products use high-lead containing solder for a die attach material in various devices.

For environmental reasons, the semiconductor industry is making an effort to eliminate high-lead solder. However, there is no single identified lead-free solution for all applications.

The DA5 group appears to advance a similar effort called E4. In 2004, Freescale joined STMicroelectronics, Infineon Technologies and Philips Electronics NV in a consortium intended to promote lead-free packaging. Formerly known as E3, the group has been renamed E4 (environmental 4) and focused on accelerating the use of lead-free packages.

''The E4 successfully implemented more environmentally friendly materials for semiconductor packages. Lead-free high melting temperature die attach was not in the scope of the E4 effort since this solder material was exempted from the 2006 EU RoHS Directive,'' according to the DA5 group.

''The announced DA5 consortium aims to reinitiate the earlier E4 cooperation and use the proven formula for success to lead the industry into the next phase of the lead-free semiconductor evolution. In this way the DA5 companies are also actively supporting the demands of the European Union towards reduced lead in electronics,'' according to the group.

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