• U.S.: Fake parts threaten electronic market

• Analysts cautious about Xilinx inventory

• What's inside Apple's media pad?

• Intel launches netbook app store

• CES: Toshiba pitching $10,000 Cell TV in the U.S.

• Mirics starts volume shipments of FlexiTV software
• Samsung signs RealD to provide 3-D TV technology

• Carbon footprint labeling: Are you ready for it?

• Chinese processor drives $99 netbook, say reports

• EE Times joins with Octopart to enhance product coverage
• EE Times joins with Octopart to enhance product coverage

• Winners, losers in touchscreen IC market

• Analyst: Taiwan foundries on allocation

• Apple accused of NAND price manipulation, says Korean report
• Samsung SGH-J750: Handling complexity and time-to-market one step at a time

• ISSCC preview: Medical device slashes tests costs

• Nanomaterials lab licenses Infiniscale's behavioral modeling tool

• PC maker sees slow road for USB 3.0

• Three charged with selling counterfeit ICs

• Comment: Semiconductor allocation? Bring it on!

• ARM and GlobalFoundries establish SoC relationship

• Lean IC inventories could create artificial sales bump
• ARM gets to sit beside Intel inside Dell laptop

• Freescale CEO upbeat about IC industry recovery, touts smartbooks

About the EETimes Supply Network Supply Chain & Logistics Section
The Supply Chain and Logistics section of EETimes Supply Network provides coverage of the companies, tools and business processes that enable efficient operations and transport of materials and product all the from materials suppliers to the end customer. Coverage includes news and trends in the outsourcing of design, manufacturing and distribution by the original equipment manufacturer (OEM) to electronics manufacturing service (EMS) providers, original design manufacturers (ODM) and third-party logistics providers (3PL).