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China Mobile gets first use of Sequans LTE chip
China Mobile selected Sequans (Paris, France) to provide TD-LTE chips and USB dongles for the world's first TD-LTE demonstration network that China Mobile plans to deploy at the World Expo 2010 in Shanghai, which begins in May. Sequans said the SQN3010 baseband SOC samples would go to first to China Mobile and then to other key customers. The chip, implemented in the 65-nm low-power CMOS process from Taiwan Semiconductor Manufacturing Co. Ltd., is designed to comply with the 3GPP release 8 standard, supporting a throughput of 100-Mbits/s in a 20-MHz channel, and LTE band classes 38 and 40. The SQN3010 is integrated with RF front-end circuitry provided by partner companies. Sequans is working with its partners, including Motorola and Alcatel-Lucent, to deliver TD-LTE USB dongles to China Mobile for LTE band class 40 (2.3 to 2.4-GHz) supporting 20 MHz channels. The dongles will be given to visitors at the World Expo 2010 so they can experience firsthand the speed and power of LTE. China Mobile intends to deploy TD-LTE service all across China. In addition to enabling China Mobile, Sequans is collaborating with Alcatel-Lucent to bring TD-LTE solutions to TD-LTE operators in Asia and Europe who are planning to offer services at 2.6-GHz. Sequans is therefore delivering a second version of its TD-LTE USB dongle for LTE band class 38 (2.5 to 2.6-GHz), as announced by the two companies last month. "Our new LTE chip will enable the first TD-LTE network deployments and we are very proud to deliver it," said Georges Karam, Sequans CEO, in a statement. Related links and articles:
Blue Wonder launches LTE modem core, software Israeli startup licenses LTE technology to Sequans Icera to open LTE R&D center in France An introduction to advanced LTE technology
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